Features
Advantages of Advanced Active Clamping
Power Semiconductor manufacturers are offering IGBT modules with ever greater power densities. The limit is represented by the maximum power loss that can be dissipated; optimisation criteria are the...
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Power Electronics Europe February News
Besides Silicon Carbide Gallium Nitride and even Gallium Arsenide will gain attraction for power semis as next events show
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Besides Silicon Carbide Gallium Nitride and even Gallium Arsenide will gain attraction for power semis as next events show
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Power Electronics Europe Events
February 26, 2010 - March 16, 2010
CIPS stands for the 6th International Conference on Power Electronics Systems Integration. It will be held from March 16 to 18 at Nuremberg’s Maritim Hotel. It will be co-organised by German VDE ETG, ECPE, ZVEI and IEEE PELS. ... Read more
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