| Next Generation High Peformance BIGT HiPaK Modules - issue 5/2010 |
September, 01 2010 |
| The practical realization of the Bimode Insulated Gate Transistor (BIGT) will provide a potential solution for furutre high voltage applications demanding compact systems with hgher power levels. In this article, we give an outlook into the new technology and the basic performance levels which could be acchieved as the BIGT progresses towards the product develoment stage.... |
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| Power Modules for Motor Control Applications - issue 5/2010 |
September, 01 2010 |
| For applications in power electronics where significant power needs to be handled in confined spaces, often the choice for packaging is not a set of discrete power components, but a dedicated power module. For that purpose CoolPAK realises an insert-molded shell which has an integrated metal lead-frame array. These lead-frames also present horizontal areas for housing bare die components as well as forming out the terminals for the outside contacts... |
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| High Voltage Phase-leg modules for medium voltage drives and inverters |
May, 18 2010 |
| Medium voltage inverters (line voltages of 1000-3300V) or auxilliary inverters for rail applications at rather low power levels of 100 to 1000 kW suffered by the lack of availability of suitable high voltage IGBT modules rated at lower current. Thus inverter manufacturers had to use odules with too high current ratings which yielded in bulky inverter designs..... |
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| Thermal behavious of three level trench gate IGBT modules in PFC and PV operation - issue 1/2010 |
March, 25 2010 |
| The control of the power semiconductors in a three-level NPC topology employs a set of 12 control signals in total. A back-to-back teo level/three level inverter has been built to circulate power performing arbitrary load conditions to analyse the thermal dissipation of the power semiconductors.... |
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| Comprehensive testing with combination testers |
December, 14 2009 |
| Increasing qulaity demands requiring 100% testing of semiconductors. Static tests are no longer enough. Only supplemental dynamic testing procdures such as swithcing unclamped inductive load and a double impulse test can meet the requirements. Inspection of thermal impedance is very important in the process. The simplest approach uses a test system that can perform all these tests. ISSUE 8/2009 |
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| Advantages of Advanced Active Clamping |
December, 14 2009 |
| Power Semiconductor manufacturers are offering IGBT modules with ever greater power densities. The limit is represented by the maximum power loss that can be dissipated; optimisation criteria are the packaging technology as well as the conduction and switching losses of the semicoductor chips. ISSUE 8/2009 |
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| Parameter Sensing in Power Electronic Modules |
October, 19 2009 |
| Modern inverter applications and electrical drive control algorithms depend on accurate measurements regarding key parameters. For the application and the inverter two parameters are of special interest. The line current driving the application and the power module’s temperature provide the necessary information on the state of operation. New power modules like Infineon’s MIPAQ family integrate proper sensors, as well as adapted electronics, to provide highly accurate readings and ease the desig |
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| Efficiency Improvement with Silicon Carbide Based Power Modules |
September, 15 2009 |
| Whereas SiC switches have the overall lowest dynamic losses, they show higher static losses due to the lack of conductivity modulation and the necessary chip size limitations due to the still high SiC base material price. |
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| Sinter Technology for Power Modules |
May, 01 2009 |
| High-power applications such as automotive, wind, solar and standard industrial drives require power modules which fulfil the demand for high reliability, thermal and electrical ruggedness. |
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| Investigations on Ageing of IGBTs Under Repetitive Short-Circuit Operations |
May, 19 2008 |
| Power Modules - Investigations on Ageing of IGBTs Under Repetitive Short-Circuit Operations. Issue 5 2008 |
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| Power Cycling Induced Failure Mechanisms in High Temperature Applications |
April, 15 2008 |
| Power Module Reliability - Power Cycling Induced Failure Mechanisms in High Temperature Applications. Issue 4 2008 |
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| Paralleling of IGBTs and Diodes of One Power Module |
April, 10 2008 |
| Power Module Paralleling - Paralleling of IGBTs and Diodes of One Power Module - Pushes Power Capability. Issue 4 2008 |
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| Power Device Technologies for Sustainable Growth of Power Conversion Applications |
April, 02 2008 |
| Power Modules - Power Device Technologies for Sustainable Growth of Power Conversion Applications. Issue 4 2008 |
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| New Intelligent Power Module Series. |
February, 29 2008 |
| Power Modules - New Intelligent Power Module Series.
Issue 2 2008
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| Passive Components |
January, 22 2008 |
| Passive Components-Application Based Resistor Selection Criteria Issue 1 2008 |
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| Low EMI Techniques for New Generation IGBT Modules |
January, 14 2008 |
| Power modules - Low EMI Techniques for New Generation IGBT Modules Issue 1 2008 |
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| Hermetic Packaging for Multichip Modules |
July, 12 2007 |
| Power Modules - Hermetic Packaging for Multichip Modules. Issue 7 2007 |
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| Pressure Sintering for Power Modules. |
July, 06 2007 |
| Power Modules - Pressure Sintering for Power Modules. Issue 7 2007 |
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| Press FIT for Solderless Assembly of Power Modules |
May, 18 2007 |
| Power Modules - Press FIT for Solderless Assembly of Power Modules. Issue 5 2007 |
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| Sensor Applications in Power Modules |
May, 03 2007 |
| Power Modules - Sensor Applications in Power Modules. Issue 5 2007 |
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| New 4500V SPT+ HiPak Modules |
April, 26 2007 |
| Power Modules - New 4500V SPT+ HiPak Modules. Issue 4 2007 |
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| New 2-Pack IGBT Module with Spring Contacts |
March, 12 2007 |
| Power Modules - New 2-Pack IGBT Module with Spring Contacts. Issue 3 2007 |
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| Voltage Insulation Power Modules |
March, 08 2007 |
| Power Modules-High - Voltage Insulation Power Modules - System Design and Qualification. Issue 3 2007 |
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| Advanced Power Modules for Telecom Applications Issue 2 2007 |
February, 19 2007 |
| Power management - Advanced Power Modules for Telecom Applications Issue 2 2007 |
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