Power_electronics Features

Innovating Power Module Packaging - April/May 21
A systemís power delivery network or PDN is made up of passive and active components such as cables, connectors, AC-DC and DC-DC converters and regulators. As power levels increase to enable new More details...
Power Electronics Europe News
Two MOSFET package options provide large insulation path lengths
The PowerFLAT 5x6 HV and PowerFLAT 5x6 VHV packages provide the large insulation path lengths and clearances required for operation at up to 650 V or 800 V, within the same 5 x 6 mm footprint of a standard 100 V PowerFLAT 5x6. This is 52 % smaller than the popular DPAK footprint, says the company. In addition, the package is only 1 mm high and features a large exposed metal drain pad that maximizes heat dissipation into PCB thermal vias. This combination of features simultaneously increases high-voltage capability, ruggedness, reliability, and system power density. In addition, ST has started sampling two new 600 V fast-switching MDmesh II Plus low gate charge MOSFETs in PowerFLAT 5x6 HV.

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