PoP modules build upon Factorized Power Architecture (FPA) systems deployed in high performance computers and large scale data centres. FPA supports efficient power distribution and direct conversion from 48V to sub-1.0V XPUs.

Current multiplication can be deployed in close proximity to high current processors. For example, a pair of MCM4608S59Z01B5T00 (MCMs) and a MCD4609S60E59H0T00 modular current multiplier driver (MCD) provide 600A continuous and up to 1000A peak at up to 1.0V. The high density, low profile package (46 x 8 x 2.7mm) and low noise attributes make MCMs suitable for co-packaging within the XPU substrate or adjacent to it. Close proximity to the XPU eliminates substantial power loss and bandwidth limitations incurred in the so-called last inch of the current delivery path from the boundaries of 12V multi-phase regulators, says the company.