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Power Electronics Europe News
Alliance is formed for 48V to low voltage on-board DC/DC converters
Artesyn Embedded Technologies, Bel Power Solutions, Flex and STMicroelectronics announced the Alliance at the Open Compute US Summit 2018.

48V direct conversion DC/DC modules (power stamps) primarily target high-performance computers and servers used in large data centres. Data centre traffic is expected to escalate as autonomous vehicles, the IoT and other applications that rely on connectivity increase.

Defining and sharing a specification for a standard product footprint and functions ensures a multi-vendor ecosystem for alternate sourcing, while encouraging a competitive supply chain through differentiation in topology, circuitry, and performance from multiple, independent manufacturers, says the alliance members.

The first processor architectures addressed are the Intel VR13 Skylake CPUs, Intel VR13-HC Ice Lake CPUs, DDR4 memories, IBM POWER9 (P9) processors and high-current ASIC and/or FPGA chipsets supporting the Serial Voltage Identification (SVID) or Adaptive Voltage Scaling (AVS) protocols.

Power stamps uses the principle of a discrete or main stamp unit controlling up to five satellite stamp units that combine to achieve more than 600A capability. The size and powertrain footprint of the main and satellite power stamps are the same, simplifying the design process for OEMs. The alliance says that as the power demands of processor and memory devices increases, the specification is scalable and can be used in tandem with existing power-conversion devices.

“The Power Stamp Alliance has developed an onboard power solution that meets the needs of hyperscale data center operators with a particular focus on supporting high-performance compute servers,” said Maggie Shillington, research analyst for IHS Markit, a global information provider. “By setting only the form factor and core functionality of the power stamp, the Power Stamp Alliance enables individual companies to leverage their expertise to provide distinct, yet compatible solutions. This allows for a potential thriving ecosystem of providers in the power stamp market.”

The PSA has published specifications, drawings and pin-out descriptions for main and satellite power stamps on its website.


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