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Edge Computing Leverages Modular Power in Scalable Micro Data Centres - May 2022
Edge computing is essential to realizing the full potential of artificial intelligence (AI), machine learning and internet of things (IoT). These technologies are being infused into every corner of...
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Power Electronics Europe News
 
The modules have an efficiency of up to 99%, enabling a low-profile package designed for space-critical applications.

They offer one of the highest power densities in a DOSA footprint, with a profile of just 3.75mm. They provide either 1.0, 2.0, 3.0, or 6.0A in the same-sized package for scalability. The 6.0A module has at least 50% higher power density than its peers on the market, claims the company, due to a new IC and multi-layer PCB layout. The module is thermally optimised to pull the heat away from the board - so without derating it delivers over 800W/in³ at up to 90°C. The ground plane in the PCB together with the metal housing, six-sided shielding guarantees EMC performance, according to the company. The RPM power modules are designed with input and output capacitors already included, meaning that the modules operate without the need for additional components.

The surface mount modules, with a land grid array package are accompanied by evaluation boards which will be released by the end of October 2018. Samples are available from all authorised distributors or directly from Recom.

 

 

 

 



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