The recent electric vehicle outlook from the International Energy Agency projects a rapid growth of global vehicle stock from 3 million vehicles in 2017 up to 228 million electric vehicles by 2030. This tremendous growth will come along with the need for cost-effective and reliable power electronics inverters within the electric powertrain of hybrid, plug-in hybrid, and battery-electric passenger vehicles, as well as light-commercial vehicles, buses, and trucks.

Thus a paper on a novel power semiconductor module platform for the automotive powertrain was awarded as the best PCIM 2019 paper. Here mold modules are designed for symmetric and minimized parasitics by applying alternating and multilayer current routing. All interconnects are solder-free to provide superior reliability, and to meet present and future automotive requirements, e.g., passing 1000 temperature shock cycles in the range of -40 to 150°C. SiC or Si devices are packaged in the same external outline offering scalability for inverter classes in the 150 – 350 kW power range. A screw-less and O-ring-less 3-phase inverter module is achieved by a laser welding of the mold modules to a low-cost Al cooler enclosure.

The PCIM Europe BPA is co-sponsored by Power Electronics Europe, it covers a price money and a trip to PCIM Asia 2020

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