Features
Power_electronics Features

Benefits of CoolSiC MOSFETs in Bi-Directional Inverter Applications - July 2021
With the move to renewable energy, there is an increased focus not only on generation but also storage, to make the most of the intermittent supply from wind and solar. Batteries are the common...
More details...
Power Electronics Europe News
 
X-FAB Becomes First Foundry to Offer High-Volume Micro-Transfer Printing

X-FAB Silicon Foundries is now able to support volume heterogeneous integration via Micro-Transfer Printing (MTP), thanks to a licensing agreement that has just been secured with X-Celeprint. This means that a diverse range of semiconductor technologies may be combined together, each being optimized for particular functional requirements. These will include SOI, GaN, GaAs and InP, as well as MEMS. X-Celeprint’s proprietary massively-parallel pick-and-place MTP technology stacks and fans-out ultra-thin dies based on different process nodes, technologies, and wafer sizes. It results in the formation of virtually monolithic 3D stacked ICs, which have enhanced performance, greater power efficiency, and take up less space. Furthermore, all this can be achieved at an accelerated rate, thereby significantly shortening time-to-market.

In order to become the first foundry to provide customers with MTP-based heterogeneous integration, X-FAB has made substantial investments over the last two years. It has also established new optimized workflows and cleanroom protocols. This will allow customers to work with the foundry on heterogeneous design projects - benefitting from a scalable business model that offers a clear migration to volume production. “By licensing X-Celeprint’s MTP technology, we are uniquely positioned in our ability to facilitate the incorporation of numerous different semiconductor technologies. Our customers will be able to utilize a technology that no other foundry is offering, and existing X-Celeprint customers may now tap into capacity levels that will easily meet their future demands,” Volker Herbig, VP of X-FAB’s MEMS business unit, explains. “As a result, we can assist customers looking to implement complete multifunctional subsystems at the wafer level, even when there are high degrees of complexity involved. Signal conditioning, power, RF, MEMS, and CMOS sensors, optoelectronic devices, optical filters, and countless other possibilities will all be covered.” AS

www.xfab.com

 



 
Go Back   
Newsletter sign up

Sponsors