Power_electronics Features

Using FREDFETs in BLDC motor drivers to overcome thermal challenges - issue 1/2019
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Linear voltage regulators operate at automotive temperatures
Designed for high reliability, high temperature applications, the CMT-Antares is Cissoid's latest regulator.
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Power Electronics Europe News
Embedded power ICs replace relays in vehicle motor control
The highly integrated, AEC Q-100 qualified H-bridge driver motor control devices are designed for two-phase DC and single-phase brushless DC motors for use in vehicle applications such as electric windows and sunroof .

The switch from relays to MOSFETs raises the level of integration and reduces system costs, says the company. Additional advantages are that the PWM control and the calibrated, integrated current sense amplifier allow the motor currents to be adapted to optimize the mechanics and motor; as the circuit board and the motor become smaller, noise behavior improves, observes the company.

The power ICs integrate an Arm Cortex-M0 processor and peripherals for motor control, power supply and communication. Two integrated measurement units (ADCs) for monitoring temperature, battery voltage and four monitoring inputs save pins. The inputs can be operated directly with battery voltage, which saves costs on additional components such as external voltage dividers or shutdown transistors. There are also two full duplex serial interfaces (UART) with LIN support.

A control algorithm is able to compensate adaptive MOSFET parameter spread by automatically adjusting the gate current according to required switching times. This optimizes electro-magnetic emissions and slow slew rates, as well as power dissipation (short dead times) simultaneously.

There are five devices available, with flash sizes from 48 to 96kbyte and with junction temperatures of up to 175 degrees C. There is also a choice of half-bridge drivers for uni- or bidirectional DC motor applications.

The power ICs are based on the same hardware and software platform as Infineon’s existing embedded power products (TLE984x, TLE986x and TLE987x), for design synergy and for customers to reuse parts of the software. The devices is supplied in a leadless VQFN package with a footprint of 7.0 x 7.0mm.


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