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Power_electronics Features

Solving the Challenges of Increasing Power Density By Reducing Number of Power Rails - March 2023
By Andy Wang, Business Line Director, High-Voltage Power Business Unit Allegro MicroSystems
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AC/DC power factor correction module offers up to 1,512W
A full brick package developed by TDK-Lambda, the PF1500B-360, is for high voltage distributed power architectures
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Power Electronics Europe News
 
Automotive MOSFET meets power density of heavy-load applications

The AUIRF8736M2  is a 40V device uses the company’s COOLiRFET silicon technology, and is claimed to offer a 40% improvement in on-state resistance (Rds (on)) compared to previous generation devices - in the same footprint, or equivalent performance to a large can device in a 50% smaller package - to minimise conduction losses.

The dual-side cooling Medium Can DirectFET2 package delivers excellent thermal performance and low parasitic inductance, claims the company. 

 

 The MOSFET is qualified to AEC-Q101 and has a lead-free package and RoHS compliant bill of materials.

 




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