As a leading provider of high-reliability materials for power electronics devices, Indium Corporation is helping manufacturers address these evolving challenges through advanced soldering, sintering, and thermal interface material technologies designed to improve reliability, thermal management, and manufacturing efficiency.

The rapid adoption of wide-bandgap semiconductors such as silicon carbide (SiC) is fundamentally changing the performance requirements for power devices. These technologies offer significant advantages in switching speed, thermal efficiency, and power density, while introducing new manufacturing challenges around thermal management, reliability, and long-term operational stability.

“Innovation in power electronics depends on materials that can withstand higher temperatures, greater power densities, and increasingly complex operating environments,” Joe Hertline, Indium Corporation Sr. Product Manager, said. “Our technologies are helping power device manufacturers push those boundaries while scaling production and balancing total cost of ownership to meet the demands for global electrification.”

Indium Corporation’s Formic Acid Soldering Technology (FAST)—including solder preforms, InFORMS, and flux-free solder pastes—enables ultra-low voiding and high-reliability solder joints without requiring post-reflow cleaning. For next-generation power modules, where even small inconsistencies in thermal performance can impact efficiency, reliability, and yield, these capabilities reduce defects and simplify manufacturing workflows.

Indium Corporation’s InFORMS reinforced solder preforms also help manufacturers improve mechanical strength and maintain consistent bondline thickness in demanding power module applications. This enhanced reliability performance is especially valuable in package-attach to cooler applications, where thermal performance and long-term durability are critical.

For die-attach applications, Indium Corporation offers two complementary sintering solutions. InFORCEMF pressure silver sinter paste is specifically designed for SiC die-attach applications and offers exceptional die shear strength, thermal conductivity, and mechanical reliability. InFORCE29 copper sinter paste supports applications requiring both high thermal conductivity and high reliability, including die-attach for Si and SiC devices and direct substrate-attach to coolers.

For manufacturers seeking sustainable alternatives to traditional high-lead solders, Indium Corporation’s Durafuse HT high-temperature lead-free paste provides a drop-in solution for existing die-attach processes without requiring specialised equipment. Functional performance and thermal cycling reliability are comparable to or exceeding high-Pb solder systems, helping manufacturers modernize production while supporting environmental goals.

The future of power electronics will not be defined by semiconductors alone. Increasingly, it will be shaped by advanced materials solutions like those developed by Indium Corporation that enable these technologies to perform reliably, efficiently, and at greater scale in an increasingly electrified world.

To learn more about Indium Corporation’s power electronics packaging and assembly solutions, visit indium.com or meet our company experts at PCIM Expo 2026, hall 6, booth 358.