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BEV advancements are driving sales, but vehicle safety and reliability will ensure long-term viability
Innovative power architectures using power modules provide power redundancy and improve overall safety and system performance By Patrick Kowalyk, Automotive FAE,Vicor
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AC/DC power factor correction module offers up to 1,512W
A full brick package developed by TDK-Lambda, the PF1500B-360, is for high voltage distributed power architectures
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Power Electronics Europe News
 
Thermally efficient power package is for EVs

The high current, thermally efficient power package meets the needs of electric vehicle (EV) applications, says the company and increases power density in automotive applications. It has a typical RDS(on) of just 0.54mΩ at a gate drive of 10V, and has a gate charge of 117nC. According to Diodes this is an industry-leading performance which enables designers of automotive high power BLDC (brushless DC) motor drives, DC/DC converters and charging systems to maximise system efficiency while minimizing power dissipation.

The PowerDI 8080-5 package has a PCB footprint of 64mm2, which is 40% less than that occupied by the TO263 (D2PAK) package format. Its off-board profile is 1.7mm, which is 63% lower than that of a TO263, reports the company. The package has a copper clip bonding between the die and the terminals which facilitates a low junction-to-case thermal resistance of 0.36°C/W. This enables the PowerDI 8080-5 to handle currents up to 460A and deliver a power density that is eight times greater than a TO263 package.

The DMTH4M70SPGWQ is AEC-Q101 qualified, PPAP (production part approval process) -capable, and manufactured in IATF 16949 certified facilities. The package has gull wing leads to facilitate optical inspection (AOI) and improve temperature cycling reliability, says Diodes. The MOSFET is available now.



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