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Power_electronics Features

BEV advancements are driving sales, but vehicle safety and reliability will ensure long-term viability
Innovative power architectures using power modules provide power redundancy and improve overall safety and system performance By Patrick Kowalyk, Automotive FAE,Vicor
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AC/DC power factor correction module offers up to 1,512W
A full brick package developed by TDK-Lambda, the PF1500B-360, is for high voltage distributed power architectures
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Power Electronics Europe News
 
SiC Driver Boards

At PCIM Europe 2018 Microsermi (hall 6-318) a new SiC MOSFET driver board showcasing Microsemi’s brand new SP6LI (low inductance) module featuring a stray inductance < 3 nH to fully benefit from SiC technology and designed to be easy to parallel up to 1200 V and 586 A. An other

SiC MOSFET driver board displaying classic SP3 module. Up to 400 kHz switching frequency, 12 V input supply and capable of 16 W of gate drive power/side. Third SiC MOSFET driver board featuring Microsemi’s SiC APTMC120AM20CT1AG power module (SP1 package - half bridge topology) and ADI ADuM4135 driver.

www.microsemi.com



 
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