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Innovative power architectures using power modules provide power redundancy and improve overall safety and system performance By Patrick Kowalyk, Automotive FAE,Vicor
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A full brick package developed by TDK-Lambda, the PF1500B-360, is for high voltage distributed power architectures
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Last year, there were 12,182 visitors and 515 exhibitors, and the conference which took place alongside the exhibition was attended by 804 international delegates, over half of them coming from outside Germany (15% from Japan, 13% France and 10% USA).
Over half of the exhibiting companies were based outside of Germany, reports Messago, the organiser, 14% were US, and companies from China, Italy, Great Britain, France and Japan made up 76% of exhibiting companies.
Power semiconductors, components and modules figure strongly in the conference programme and exhibition. Exhibitors that have been announced for 2020, include Infineon, Semikron, Rohm and Kemet, with 40 new exhibitors, including distributor Arrow Germany, IC manufacturer, TowerJazz and switching power supplies and DC fans manufacturer, Delta Electronics as well as Kohsel, which makes tailored transformers.
The conference, which runs alongside the exhibition, will include topics for the industry, including e-mobility, which will be discussed in an E-mobility Forum and dedicated area. The programme includes lectures as well as poster sessions over three days.
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