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BEV advancements are driving sales, but vehicle safety and reliability will ensure long-term viability
Innovative power architectures using power modules provide power redundancy and improve overall safety and system performance By Patrick Kowalyk, Automotive FAE,Vicor
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AC/DC power factor correction module offers up to 1,512W
A full brick package developed by TDK-Lambda, the PF1500B-360, is for high voltage distributed power architectures
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Power Electronics Europe News
 
Four-channel amplifier claims to transform hi-fi automotive audio design
It is, says the company, the first 2.1MHz Class-D audio amplifier specifically designed for automotive applications. It supports high-resolution 96kHz digital input and eliminates up to 18 external components to save system space and cost, compared to existing Class-D device, says the company.

Maximum output power of the TAS6424-Q1 delivers 75W per channel and it is claimed to offer the industry’s highest switching rate and is the only audio amplifier that switches above the AM band.

This capability reduces EMI, by eliminating the need for complex avoidance schemes and eases EMC designs while enabling the system to meet Comité International Spécial des Perturbations Radioélectriques (CISPR) 25 Class 5 EMC requirements.

The amplifier supports low impedance by maintaining stable audio playback while driving low impedance loads of 2Ω. Another feature is the advanced AC load diagnostics and line driver mode. The amplifier provides detailed on-chip phase and impedance measurements that designers can use to configure the device with various outputs, such as woofer, tweeter and line-level connections.

An integrated DAC converter helps deliver a low system output noise of 42µVrms for automotive designs like external amplifiers and head units. Power dissipation is reduced by as much as 60% compared to Class-AB amplifiers, says the company, greatly reducing the need for fans or large heatsinks.

The PurePath Console GUI is available to help designers easily configure the TAS6424-Q1. To simulate and optimize the device, designers can download an IBIS model or request a TAS6424-Q1 evaluation module.

The TAS6424-Q1 is available now in a PowerPAD thermally-enhanced, shrink small-outline package (HSSOP).

 

 



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