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Power Electronics Europe Events
 
CIPS 2020 March 24 26 in Berlin
February 11, 2020 - March 26, 2020

CIPS is consequently focused on aspects such as assembly and interconnect technology for power electronic devices and converters, integration of hybrid systems and mechatronic systems with high power density, and systems‘ and components‘ operational behavior and reliability. Basic technologies for integrated power electronic systems as well as upcoming new important applications will be presented in interdisciplinary invited papers.

GaN Workshop

A day before CIPS (March 23), a workshop “Circuit Technology for GaN Devices in Power Electronics” in German language will take place in the same hotel as CIPS 2020 (Mercure Hotel MOA Berlin).

GaN components have undergone rapid development in recent years and are becoming more and more established in applied power electronics. Meanwhile, power semiconductor devices from various manufacturers are commercially available in different designs and technologies as well as voltage and current classes and are on their way to application. More and more users are investing in research and development to exploit the potential of fast GaN semiconductor switches for their systems. This raises many questions about suitable transistor technology, optimal circuit topologies, gate driver units and practical implementation, for example with regard to construction and integration techniques or EMC. In addition to the classic hard switching applications, in which the low forward resistances of the GaN components are used, users focus on the high switching frequencies achievable with GaN as well as resonant or quasi-resonant circuits.

CIPS Keynotes

The program covers four keynotes. First is “Power Cycling - Methods, Measurement Accuracy, Comparability”, given by Professor for Power Electronics and Electromagnetic Compatibility at the Chemnitz University of Technology. Power cycling capability is a main criterion for the design of power electronics equipment. It is a clear progress that there is now a European standard for power modules. Power electronics evolves to higher power density packages. This leads to systematic measurement errors which have been neglected in the past. They are now of significant influence and should be considered as well. When going from Si to SiC devices, especially SiC MOSFETs, a new test method is suggested. More semiconductor physics related effects have to be taken into account, and not all modifications during ageing of a device can be adjusted to the ageing of the interconnections, as it is practice with Si. A more detailed test documentation is recommended.

The second keynote is entitled “Wide-Bandgap Semiconductor Power Electronics: Overcoming Barriers in Materials to Circuits for a more Electrified Future” to be presented by Dr. Isik C. Kizilyalli currently serves as a Program Director at the Advanced Research Projects Agency – Energy (ARPA-E), Department of Energy. The third keynote will cover “Capacitor-Based Power Converters for High Power Density and Efficiency - the Theoretical Promises and Practical Challenges” by Robert Pilawa-Podgurski, currently an Associate Professor in the Electrical Engineering and Computer Sciences Department at the University of California/USA.

The fourth keynote “Present and Future of Fault Tolerant Drives applied to Transport Applications” will be presented by Prof. Volker Pickert, leader of the Electrical Power Group at Newcastle University/UK. As part of the “electrical revolution” electric drives are increasingly being developed for safety critical applications, where their reliability is several orders of magnitude below the application requirements. This is particularly the case in electrical propulsion and actuation systems in aircraft, leading to intensive research into fault tolerant electric drives. The paper will illustrate some of the most common failure mechanisms and the consequences of such failures. It will then progress to examine architectures which are fault tolerant through partitioning of the drive into a number of independent lanes and examine the penalties of adopting such an approach. The paper will discuss pros and cons of different fault tolerant architectures and suggests future research and development steps that are required to increase the overall safety of electric drives.

www.cips.eu

 

 
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