·         Automotive and Industrial: AOS is introducing its AEC-Q101 qualified Generation 3 1200V SiC MOSFET technology that will provide a 20-30 percent loss improvement compared to the already leading Gen 2 technology.  This performance enhancement will not come with a penalty to robustness as the Gen3 technology has improved ruggedness, including full HV-H3TRB compliance for harsh environment applications. These new MOSFETs expand the existing automotive-qualified 650V, 750V, 1200V, and 1700V SiC MOSFETs in through-hole and surface mount/topside cooled packages. The 1200V Gen3 SiC MOSFETs will initially be available from 15mohm to 40mohm in TO247-4L packages with production starting May 2025.

·         Intelligent Power Modules, Mega IPM-7: AOS has integrated its latest G2 IGBT and high-voltage gate driver into the world's most compact package design, delivering mega power of up to 100W for motor control applications. The portfolio covers 600V / (1A−3A) in various package options (Mega IPM-7D, IPM-7DT, IPM-7E) that are ideal solutions for various design requirements.

·         Motor Drive ICs: AOS will announce a new range of 60V and 100V driver ICs for power tools, outdoor garden equipment, and e-mobility applications, including a 100V half-bridge driver IC, a 100V 3-phase driver IC, and a 60V 3-phase driver IC. These products all support 100 percent duty cycle operation. Plus, demo boards using AOS’ motor driver IC and AlphaSGT™ MOSFETs (30V−150V) will be featured.

·         eFuse: AOS’ Hot Swap Controllers and Power MOSFET combined into a single eFuse package. The eFuse can improve the system’s reliability by isolating the load from the main power rails in case of a fault condition. AOS will announce its latest 12V/60A eFuse products in May 2025.

·         State-of-the-art Packaging: AOS’ highly efficient 25V−150V MOSFETs are available in advanced packaging, including a double-sided cooling DFN 5x6 that delivers industry-leading thermal resistance. Also available are two robust packages, LFPAK 5x6 package and the GLPAK™, which features gull-wing leads for enhanced board reliability and larger copper clips that significantly improve current carrying capability. In addition, the GTPAK™ is a topside cooling package designed with a large exposed pad for more efficient heat transfer.

·         Where:  PCIM 2025, Nuremberg, Germany

·         When:  May 6 - 8, 2025

·         Location:  Alpha and Omega Semiconductor, Booth # 9-539