High-power applications such as electric vehicle charging, battery energy storage systems, and commercial, construction and agricultural vehicles (CAVs) are driving the demand for higher system-level power density and efficiency to meet increasing performance expectations. At the same time, these requirements introduce new design challenges, including reliable operation under harsh environmental conditions, robustness against transient overloads, and optimised overall system performance.

To address these challenges, Infineon Technologies has announced it has launched it has launched the CoolSiC MOSFETs 1400 V G2 in the TO-247PLUS-4 Reflow package. The devices support higher DC-link voltages and enable improved thermal performance, reduced system size and enhanced reliability. 
 
The package technology supports reflow soldering at 260°C for up to three cycles and enables reliable operation with junction temperatures up to 200°C, while ensuring high peak current capability. Leveraging the Infineon .XT interconnection technology, the devices deliver improved thermal performance and enhanced mechanical robustness for demanding environments. The new 1400 V voltage class provides additional margin for faster switching and simplifies protection measures against overvoltage. This eliminates the need for power derating and contributes to overall system robustness. 
 
The CoolSiC MOSFETs 1400 V G2 in the TO-247PLUS-4 Reflow package are available in RDS(on) classes from 6 to 29 mΩ and suitable for applications where high power density is crucial, such as CAVs, electric vehicle charging and battery energy storage systems. Infineon also offers CoolSiC MOSFETs 1400 V in a TO-247-4 package with high creepage. RDS(on) classes for this portfolio range from 11 to 38 mΩ, with devices suitable also for applications such as photovoltaic. 
 

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