
MHz switching frequency-based devices enable miniaturization of the DC-DC converter and EMI filters
Achieving EMI conducted emission compliance for automobiles with a single stage filter. By Nicola Rosano, Sr. Strategic FA/System Engineer at Vicor
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A full brick package developed by TDK-Lambda, the PF1500B-360, is for high voltage distributed power architectures
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AOS says its latest MOSFET is designed as an ideal solution for 48V Hot Swap architectures in AI servers. The power demands of AI servers are intensifying, primarily driven by the increasing performance in the GPU/TPU. In addition to its wide SOA capability, the AOLV66935 Hot Swap MOSFET features very low on-resistance to meet these performance, efficiency and reliability challenges.
The AOLV66935 utilises AOS’ 100V AlphaSGT proprietary MOSFET technology that combines the advantages of trench technology for low on-resistance with high SOA capability. AOS has tested and characterised the SOA at 25°C as well at higher operating conditions of 125°C giving system architects the confidence that the device will operate reliably under harsh conditions. Available in AOS’ state-of-the-art packaging, the MOSFET’s LFPAK 8x8 gull-wing constructed package is 60% smaller compared to the TO-263 (D2PAK) package. It also features advanced clip technology with a high current rating to provide high inrush current capabilities. In addition, the copper clip and packaging technology used offers low thermal resistance for improved thermal management. The AOLV66935 is manufactured in IATF 16949-certified facilities, and its LFPAK 8x8 packaging is compatible with automated optical inspection (AOI) manufacturing requirements.
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