Features
MHz switching frequency-based devices enable miniaturization of the DC-DC converter and EMI filters
Achieving EMI conducted emission compliance for automobiles with a single stage filter. By Nicola Rosano, Sr. Strategic FA/System Engineer at Vicor
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AC/DC power factor correction module offers up to 1,512W
A full brick package developed by TDK-Lambda, the PF1500B-360, is for high voltage distributed power architectures
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A full brick package developed by TDK-Lambda, the PF1500B-360, is for high voltage distributed power architectures
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Power Electronics Europe News
Rutronik Expands its Edge-AI Offering: ADLINK cExpress-R8: COM-Express Module for AI Applications
With the cExpress-R8, Rutronik says it is introducing a high-performance COM Express R3.1 Type 6 module from ADLINK, designed for AI-driven edge computing. Powered by the AMD Ryzen Embedded 8000 Series, it delivers up to 40 TOPS AI inference performance.
The company says combining high compute power, AI acceleration, extensive I/O connectivity and a compact form factor, the cExpress-R8 is ideal for industrial automation, medical imaging, transportation and surveillance platforms, as well as edge-oriented video and analytics solutions. ADLINK also guarantees a 10-year product lifecycle – critical for long-term system designs. The module is available at www.rutronik24.com.
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The company says combining high compute power, AI acceleration, extensive I/O connectivity and a compact form factor, the cExpress-R8 is ideal for industrial automation, medical imaging, transportation and surveillance platforms, as well as edge-oriented video and analytics solutions. ADLINK also guarantees a 10-year product lifecycle – critical for long-term system designs. The module is available at www.rutronik24.com.
cExpress-R8 from ADLINK is a COM Express R3.1 Type 6 Compact module (95 × 95 mm) designed for demanding edge-AI applications. It is powered by AMD Ryzen Embedded 8000 Series processors with up to eight Zen 4 CPU cores, integrated RDNA 3 GPU architecture and an XDNA NPU for AI acceleration – offering up to 40 TOPS combined CPU, GPU and NPU performance..
The module supports up to 96 GB DDR5-5600 memory (ECC and non-ECC), up to four independent displays (via DisplayPort, HDMI, eDP / LVDS or VGA), 16 PCIe Gen4 lanes, 4x USB 3.2 Gen2, 4x USB 2.0, 4× SATA 6 Gb / s, 2.5 GbE network with optional TSN and TPM 2.0 security.
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