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Product highlights include the latest in Navitas GaNFast FETs starting from 0.8 mOhms at 100 V to 11 mOhms at 650 V, along with expanded offerings across the GaNSafe, GaNSlim, and Bi-directional GaN IC product families.
Navitas will showcase 3300 V, 2300 V, and 1200 V Trench Assisted Planar (TAP) SiC devices using advanced reliability SiCPAK press-fit modules, alongside recently announced 5th-generation GeneSiC TAP MOSFETs for AI-Data Centre in QDPAK and TO247-LP.
For the AI data centre, Navitas will exhibit two solutions that enable a swifter transition to the 800 VDC standard using GaN:
- 20 kW 800 V-to-6 V power delivery board aiming 97.5% peak efficiency, eliminating the traditional 48V intermediate bus converter (IBC) stage while enhancing overall system efficiency, reliability, cost-effectiveness, and power density.
- 10 kW 800 V-to-50 V DC-DC platform featuring 2.1 kW/in³ power density and 98.5% peak efficiency, leveraging the latest 650 V and 100 V GaNFast FETs to deliver industry-leading efficiency, power density, and performance for 800 VDC and ±400 V power architectures.
For grid and energy infrastructure, Navitas will showcase two SST topologies enabled by Navitas GeneSiC UHV and HV technology:
- An EPFL-developed full SST cell integrating the primary converter stage, transformer, and secondary conversion stage using a novel single-stage topology, leveraging Navitas 3300 V and 1200 V SiC technology.
- 50KVA Bi-Directional Active Front End, DAB SST solution based on Navitas 3300 V SiCPAK MOSFET modules, using Texas Instruments’ C2000TM real-time microcontrollers and UCC218915-Q1 gate driver.
Navitas will also showcase industrial electrification and motor control inverter solutions based on GaNSense™ Motor Drive ICs, integrating lossless current sensing, voltage sensing, and temperature protection for improved performance and robustness. In addition, GaNSlim power ICs will showcase simplified development of high-efficiency, high-power-density solutions with industry-leading integration for performance computing applications.
Tuesday, June 9th | 1:25 -2:25 PM CET
Componeers Panel Session: Automotive, AI, Humanoid Robots – the future of GaN
Technology Stage, Hall 4, PCIM Expo & Conference
Presenter: Llew Vaughan-Edmunds, VP & GM, GaN Business Unit
Wednesday, June 10 | 11:45 am – 12:45 pm CET
Power Electronics News Panel Session: The Evolution in Data Center Power Distribution
Technology Stage, Hall 4, PCIM Expo & Conference
Presenter: Llew Vaughan-Edmunds, VP & GM, GaN Business Unit
Wednesday, June 10th | 2:30 – 3:30 PM CETBodo’s Panel Session: “Riding the SiC Wave Efficiently”
Technology Stage, Hall 4, PCIM Expo & Conference
Presenter: Paul Wheeler, VP & GM, High Voltage SiC Business Unit
Thursday, June 11th | 11:45 AM – 12:45 PM (CET)Bodo’s Panel Session: “What’s up, what’s next for GaN?”
Technology Stage, Hall 4, PCIM Expo & Conference
Presenter: Llew Vaughan-Edmunds, VP & GM, GaN Business Unit
Navitas booth is located in Hall 9, Booth #544 at NürnbergMesse from June 9–11. You can find more detailed information about what Navitas is showcasing at PCIM Europe 2026 at: https://navitassemi.com/event/pcim-2026/
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