Among the highlights will be the debut of mAgic PE340 silver pressure sinter paste for dense packaging. It offers precise printing and defined edge formation for optimised material use. Multi-process compatibility - including printing, dispensing, and dry or wet placement – ensures seamless integration into production.

Heraeus Electronics will also showcase the new Microbond solder preforms which improve reliability over traditional alloys and uses Innolot technology for lower melting temperatures. The latest Innolot 2.0 reduces silver content while maintaining performance, supporting IGBT applications up to 150 °C junction temperature.

Connect with our experts to gain insights, discuss your challenges, and explore how our products and solutions can benefit your business.

You are invited to join our live product presentations at our booth #6-310