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FPA56D MOSFETs save space in automotive designs

Offered as an alternative to half bridge packs automotive MOSFETs configured as two MOSFETs in a standard building block, the BUK7V4R2-40H and the BUK9V13-40H are supplied in an FPA56D package. The AEC-Q101-qualified half bridge package is suitable for a range of three-phase automotive powertrain applications such as fuel and water pumps, motor control and DC/DC power conversion.   

The half bridge MOSFETs are supplied in an FPA56D package which has no PCB tracks, which results in the devices occupying 30% less PCB area compared to dual MOSFETs for three-phase motor control topologies. The package also allows automated optical inspection (AOI) during production.

The LFPAK56D half bridge uses existing assembly processes with proven automotive reliability, explains Nexperia. The package uses flexible leads and an internal copper clip connection between the MOSFETs to simplify PCB designs. Current handling capability is 98A.

According to the company, connection by the internal clips result in 60% lower parasitic inductance and the package also offers improved thermal performance for power train, motor control and DC/DC applications.

Both half bridge MOSFETs use the Trench 9 automotive silicon process technology and are rated at 40V. They are verified at twice the automotive AEC-Q101 specification in key tests. RDS(on) is 4.2mΩ and 13mΩ for the BUK7V4R2 and BUK9V13, respectively.

 

 

 



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