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Power_electronics Features

BEV advancements are driving sales, but vehicle safety and reliability will ensure long-term viability
Innovative power architectures using power modules provide power redundancy and improve overall safety and system performance By Patrick Kowalyk, Automotive FAE,Vicor
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AC/DC power factor correction module offers up to 1,512W
A full brick package developed by TDK-Lambda, the PF1500B-360, is for high voltage distributed power architectures
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Power Electronics Europe News
 
MOSFET family reduces ringing in synchronous buck applications
The 25V FastIRFET family, can be used in telecomms and netcomms equipment, servers, graphic cards, desktop, ultrabook and notebook computers.
 
They feature the company’s latest generation silicon in an industry standard PQFN package that is claimed to deliver benchmark power density for discrete DC/DC converters. In the family is the IRFH4201, which offers on-state resistance (RDS(on)) as low as 0.7mΩ. There is also the IRFH4210D and IRFH4213D monolithic FETKY devices, designed to reduce ringing and further improve system efficiency.
 
The MOSFETs are claimed to offer industry leading power density for discrete high performance DC/DC switching applications. They complement the company’s integrated SupIRbuck, PowIRstage and power block platform.
 
Optimised for 5V gate drive applications, the devices work with any controller or driver. They are available in industry standard 5x6 and 3.3x3.3mm PQFN packages that feature an environmentally friendly, lead-free and RoHS compliant bill of materials.
 


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