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Power_electronics Features

Edge Computing Leverages Modular Power in Scalable Micro Data Centres - May 2022
Edge computing is essential to realizing the full potential of artificial intelligence (AI), machine learning and internet of things (IoT). These technologies are being infused into every corner of...
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Power Packaging Features
 
A new standard in dual power MOSFET packaging - issue 3/2014 May, 29 2014
International Rectify's patented (US6946740) new dual Power MOSFET in a power quad flat no-lead (PQFN) package leverages the latest advacnes in packaging technology to increase power density...
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New Thermal Design Options Drives Power Density - issue 7/2013 November, 04 2013
With every generation, electronic products shrink while functionality expands and performance improves. Despite efforts to hold the line on product power dissipation, pressure to increase power density in energy-management subsystems continues unabated....
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