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Power_electronics Features

Power of the Module - Nov/Dec 2020
Vicor has established a power module capability spanning product design, manufacturing, simulation and selection tools. This capability allows Vicor to enable power systems designers to quickly and...
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Power Packaging Features
 
A new standard in dual power MOSFET packaging - issue 3/2014 May, 29 2014
International Rectify's patented (US6946740) new dual Power MOSFET in a power quad flat no-lead (PQFN) package leverages the latest advacnes in packaging technology to increase power density...
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New Thermal Design Options Drives Power Density - issue 7/2013 November, 04 2013
With every generation, electronic products shrink while functionality expands and performance improves. Despite efforts to hold the line on product power dissipation, pressure to increase power density in energy-management subsystems continues unabated....
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