Features
Power_electronics Features

Innovating Power Module Packaging - April/May 21
A systemís power delivery network or PDN is made up of passive and active components such as cables, connectors, AC-DC and DC-DC converters and regulators. As power levels increase to enable new More details...
Power Packaging Features
 
A new standard in dual power MOSFET packaging - issue 3/2014 May, 29 2014
International Rectify's patented (US6946740) new dual Power MOSFET in a power quad flat no-lead (PQFN) package leverages the latest advacnes in packaging technology to increase power density...
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New Thermal Design Options Drives Power Density - issue 7/2013 November, 04 2013
With every generation, electronic products shrink while functionality expands and performance improves. Despite efforts to hold the line on product power dissipation, pressure to increase power density in energy-management subsystems continues unabated....
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