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Achieving EMI conducted emission compliance for automobiles with a single stage filter. By Nicola Rosano, Sr. Strategic FA/System Engineer at Vicor
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A full brick package developed by TDK-Lambda, the PF1500B-360, is for high voltage distributed power architectures
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Housed in a 2mm x 1.45mm S-VSON(L) package, and weighing less than 0.01g, the new relays are said to let equipment designers achieve high-density mounting within tight space constraints and form-factor restrictions. With pin-to-pin capacitance as low as 0.6pF, and turn-on/turn-off time as fast as 0.08ms/0.12ms, they can handle high-speed interfacing in automatic test equipment (ATE) and high-speed logic testers. In addition, leakage current of just 1nA helps ensure high measurement accuracy.
Development labs and production facilities operating in technologies like semiconductors, 5G, and autonomous robots are demanding test equipment with more channels, more measurements, faster inspection cycles, and higher frequency range. By introducing the 20V G3VM-21QR and G3VM-21QR1, and 40V G3VM-41QR4, OMRON is empowering test equipment builders to meet their needs.
The type-1a normally open (SPST-NO) relays have the lowest capacitance and resistance in the G3VM series, enabling extremely responsive switching that permits faster measurements and shorter test-cycle times. Their ultra-miniature 4-pin outline, more than 18% smaller than the VSON package, lets designers scale the channel count in new equipment and simplifies replacing mechanical relays with MOSFET relays.
The G3VM-21QR, G3VM-21QR1, and G3VM-41QR4 are in production now.
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