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Power Electronics Europe News
Silicon capacitor saves space in smartphones and wearables
Silicon capacitors in the BTD1RVFL series use thin film semiconductor technology to  provide higher capacitance in a thinner form factor than existing multilayer ceramic capacitors (MLCCs), says the company. They also have stable temperature characteristics.

The silicon capacitors manufactured using proprietary RASMID miniaturisation technology allow processing in 1µm increments that eliminates chipping during external formation and improves dimensional tolerances within ±10µm. As a result, they can be mounted at narrower distances between adjacent components. In addition, the rear electrode used for bonding to the substrate has been expanded to the periphery of the package to improve mounting strength.

The two initial capacitors in the series are the BTD1RVFL102 and BTD1RVFL471. They are in the industry’s smallest 01005-size (0.1 x 0.05inch) / 0402-size (0.4 x 0.2mm) mass-produced surface mount silicon capacitors. The mounting area is reduced by approximately 55% over general 0201-size / 0603-size products to just 0.08mm2. An integral TVS protection element ensures high ESD resistance that minimises the time required to be spent for surge countermeasures and other circuit design elements.

The capacitors can be used in smartphones, wearables, compact IoT devices and optical transceivers.

They are available via online distributors DigiKey and Mouser.



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