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Encapsulated 80A digital power module is for FPGAs and memory

The ISL8273M provides high power density PoL conversions for advanced FPGAs, processors and memory, says the company.

The step-down regulated power supply delivers up to 80A output current and operates from industry standard 5.0 or 12V input power rails. Multi-phase current sharing of up to four modules enables designers to create a 320A solution with output voltages as low as 0.6V.

The module is housed in a compact 18 x 23mm module, for what is claimed to be the industry’s highest power density and performance for space-constrained data centre equipment and wireless communications infrastructure systems.

Patented ChargeMode control architecture is claimed to deliver best-in-class efficiencies, with up to 94% peak efficiency and better than 90% efficiency on most conversions. It also provides a single clock cycle fast transient response to output current load steps common in FPGAs and DSPs processing power bursts. The compensation-free design keeps the device stable regardless of output capacitor changes due to temperature, variation or aging while eliminating the need for an external discrete compensation network.

The proprietary High Density Array (HDA) package is claimed to offer unmatched electrical and thermal performance through a single-layer conductive package substrate that reduces lead inductance and dissipates heat primarily through the system board.

Through a PMBus-compliant interface, the digital control technology provides precise sequencing, full telemetry and system monitoring. The module can also start up and operate in pin-strap mode using six external resistors for setting default configurations such as Vout, soft-start, under-voltage, switching frequency and current sharing. This allows designers to power up the modules during the development phase without using PMBus or requiring any programming.

The ISL8273MEVAL1Z 80A digital module evaluation board is also available.

 



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