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Benefits of CoolSiC MOSFETs in Bi-Directional Inverter Applications - July 2021
With the move to renewable energy, there is an increased focus not only on generation but also storage, to make the most of the intermittent supply from wind and solar. Batteries are the common...
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Power Electronics Europe News
 
Two MOSFET package options provide large insulation path lengths
The PowerFLAT 5x6 HV and PowerFLAT 5x6 VHV packages provide the large insulation path lengths and clearances required for operation at up to 650 V or 800 V, within the same 5 x 6 mm footprint of a standard 100 V PowerFLAT 5x6. This is 52 % smaller than the popular DPAK footprint, says the company. In addition, the package is only 1 mm high and features a large exposed metal drain pad that maximizes heat dissipation into PCB thermal vias. This combination of features simultaneously increases high-voltage capability, ruggedness, reliability, and system power density. In addition, ST has started sampling two new 600 V fast-switching MDmesh II Plus low gate charge MOSFETs in PowerFLAT 5x6 HV.

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