Features
Solving the Challenges of Increasing Power Density By Reducing Number of Power Rails - March 2023
By Andy Wang, Business Line Director, High-Voltage Power Business Unit Allegro MicroSystems
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AC/DC power factor correction module offers up to 1,512W
A full brick package developed by TDK-Lambda, the PF1500B-360, is for high voltage distributed power architectures
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A full brick package developed by TDK-Lambda, the PF1500B-360, is for high voltage distributed power architectures
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Power Electronics Europe News
March 31, 2020
TDK-Lambda’s EZA2500W-32048 is designed for energy storage systems with rechargeable batteries....
Infineon adds six devices in a surface mount, D²PAK two-pin package to its CoolSiC Schottky diode 1,200V family....
The EPC2152 is the first in a family of ICs from Efficient Power Conversion (EPC) which targets high-density applications....
STMicroelectronics’ STWLC68 integrated devices are for wireless-charging applications and boast industry-leading efficiency...
Infineon Technologies says its 600V CoolMOS S7 S7 MOSFETs offer best-in-class price and performance...
Infineon Technologies says its 600V CoolMOS S7 S7 MOSFETs offer best-in-class price and performance...
March 4, 2020
Power Integrations says its high-voltage half-bridge motor-driver needs no heatsinks and reduces software certification time...
March 3, 2020
Maxim Integrated says it has developed the industry’s smallest lidar ICs, with over more bandwidth in the same form factor...
The AIM702H50B, developed by Alpha and Omega Semiconductor integrates a super junction MOSFET in a surface mount package...
February 28, 2020
Cosel has expanded its series of microprocessor-controlled power supplies with the introduction of the FETA3000BA...
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